Shenzhen Tianweisheng Electronic Co., Ltd.
Main products:PCB,FPC
Contact Us
  • Contact Person : Ms. Gong Grace
  • Company Name : Shenzhen Tianweisheng Electronic Co., Ltd.
  • Tel : 0086-755-29087997,13510820959
  • Fax : 0086-755-29667579
  • Address : Guangdong,Shenzhen,28/D, Tower D, Jingangting, West of Bao'an Road, Xixiang Street, Bao'an District
  • Country/Region : China
  • Zip : 518102

multilayer pcb with BGA

multilayer pcb with BGA
Product Detailed
Related Categories:Multilayer PCB
Related Product Searches:multilayer pcb with BGA,High Quality,BGA, multilayer pcb,VV65
multilayer pcb with BGA 1.UL,SGS,ROHS,IS09001,CE,IPC 2..High quality&competitive price 3..Quickly delivery&OEM.

multilayer pcb with BGA

 1.Base Material:fr4

2.copper thickness:2oz

3.board thickness:1.6mm

4.Surface treatment:ENIG


The advantages:

1.Transportation by ship,by express,up to you

2.A line with automatic production,decrease more cost for mass production.3.. No middlemen/No trading companies,OEM4.. Good prices,high quality for automatic,lowest cost,quickly time.

5.Delivery time: Sample is 2-3 days and mass production is 5-12days.6.Top of China within this line.

7..Inner vacuum and plastic package,outer carton box package.

8.Good wills for our clients and good credit for B2B.

9..payment:by T/T or L/C

10.High quality and competitive price

Please don't hesitate to send us your Gerber files now.

With a wide range, good quality, reasonable prices and stylish designs, our products are extensively used in aerospace,

medical equipment, telecommunication and other industries. For many years, our products have been well received by

the markets and trusted by our customers.With 6 years' experience and dedicated staff, we are now able to reach a monthly production capacity of 12000 square

meters of boards complying with UL, RoHS and other international certificate standards

productive power:

 Specification Inch (mm) 
MaterialFR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium
Layer No.1-30
Board thickness0.015" (0.4mm)-0.125" (3.2mm)
Board Thickness Tolerance± 10%
Cooper thickness1/2OZ-3OZ
Impedance Control± 10%
Peelable0.012" (0.3mm)-0.02’ (0.5mm)
Min Trace Width (a)0.005" (0.125mm) 
Min Space Width (b)0.005" (0.125mm)
Min Annular Ring0.005" (0.125mm) 
SMD Pitch (a)0.012" (0.3mm) 
BGA Pitch (b)0.027" (0.675mm)
Regesiter torlerance0.05mm
Min Solder Mask Dam (a)0.005" (0.125mm) 
Soldermask Clearance (b)0.005" (0.125mm)
Min SMT Pad spacing (c)0.004" (0.1mm)
Solder Mask Thickness0.0007" (0.018mm)
Hole size0.01" (0.25mm)-- 0.257" (6.5mm)
Hole Size Tol (+/-)± 0.003" (± 0.0762mm)
Aspect Ratio6: 1
Hole Registration0.004" (0.1mm)
Lead free HASL2.5um
Immersion GoldNickel  3-7um  Au: 1-3u' '
Panel Outline Tol (+/-)± 0.004' ' (± 0.1mm)
Beveling30° 45°
V-cut15° 30° 45° 60°
Certificate ROHS  ISO9001: 2000  TS16949  SGS   UL

sample picture

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multilayer pcb with BGA

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