HDI PCB with BGA, Blind and Buried via, Made of FR4 Material

HDI PCB with BGA, Blind and Buried via, Made of FR4 Material 1.UL,SGS,ROHS,IS09001,CE,IPC 2..High quality&competitive price

HDI PCB with BGA, Blind and Buried via, Made of FR4 Material

1.Base Material:fr4

2.copper thickness:2oz

3.board thickness:1.6mm

4.Surface treatment:ENIG

5.layer:4-layer

productive power:

	Specification Inch (mm)
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium
Layer No.	1-30
Board thickness	0.015" (0.4mm)-0.125" (3.2mm)
Board Thickness Tolerance	± 10%
Cooper thickness	1/2OZ-3OZ
Impedance Control	± 10%
Warpage	0.075%-1.5%
Peelable	0.012" (0.3mm)-0.02’ (0.5mm)
Min Trace Width (a)	0.005" (0.125mm)
Min Space Width (b)	0.005" (0.125mm)
Min Annular Ring	0.005" (0.125mm)
SMD Pitch (a)	0.012" (0.3mm)
BGA Pitch (b)	0.027" (0.675mm)
Regesiter torlerance	0.05mm
Min Solder Mask Dam (a)	0.005" (0.125mm)
Soldermask Clearance (b)	0.005" (0.125mm)
Min SMT Pad spacing (c)	0.004" (0.1mm)
Solder Mask Thickness	0.0007" (0.018mm)
Hole size	0.01" (0.25mm)-- 0.257" (6.5mm)
Hole Size Tol (+/-)	± 0.003" (± 0.0762mm)
Aspect Ratio	6: 1
Hole Registration	0.004" (0.1mm)
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel  3-7um  Au: 1-3u' '
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	± 0.004' ' (± 0.1mm)
Beveling	30° 45°
V-cut	15° 30° 45° 60°
Certificate	ROHS  ISO9001: 2000  TS16949  SGS   UL

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HDI PCB with BGA, Blind and Buried via, Made of FR4 Material