Shenzhen Tianweisheng Electronic Co., Ltd.
Main products:PCB,FPC
Products
Contact Us
  • Contact Person : Ms. Gong Grace
  • Company Name : Shenzhen Tianweisheng Electronic Co., Ltd.
  • Tel : 0086-755-29087997,13510820959
  • Fax : 0086-755-29667579
  • Address : Guangdong,Shenzhen,28/D, Tower D, Jingangting, West of Bao'an Road, Xixiang Street, Bao'an District
  • Country/Region : China
  • Zip : 518102

HDI PCB with BGA, Blind and Buried via, Made of FR4 Material

HDI PCB with BGA, Blind and Buried via, Made of FR4 Material
Product Detailed
HDI PCB with BGA, Blind and Buried via, Made of FR4 Material 1.UL,SGS,ROHS,IS09001,CE,IPC 2..High quality&competitive price

HDI PCB with BGA, Blind and Buried via, Made of FR4 Material

1.Base Material:fr4

2.copper thickness:2oz

3.board thickness:1.6mm

4.Surface treatment:ENIG

5.layer:4-layer

productive power:

 Specification Inch (mm) 
MaterialFR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium
Layer No.1-30
Board thickness0.015" (0.4mm)-0.125" (3.2mm)
 
Board Thickness Tolerance± 10%
Cooper thickness1/2OZ-3OZ
Impedance Control± 10%
Warpage0.075%-1.5%
Peelable0.012" (0.3mm)-0.02’ (0.5mm)
Min Trace Width (a)0.005" (0.125mm) 
Min Space Width (b)0.005" (0.125mm)
Min Annular Ring0.005" (0.125mm) 
SMD Pitch (a)0.012" (0.3mm) 
BGA Pitch (b)0.027" (0.675mm)
Regesiter torlerance0.05mm
Min Solder Mask Dam (a)0.005" (0.125mm) 
Soldermask Clearance (b)0.005" (0.125mm)
Min SMT Pad spacing (c)0.004" (0.1mm)
Solder Mask Thickness0.0007" (0.018mm)
Hole size0.01" (0.25mm)-- 0.257" (6.5mm)
Hole Size Tol (+/-)± 0.003" (± 0.0762mm)
Aspect Ratio6: 1
Hole Registration0.004" (0.1mm)
Plating
HASL2.5um
Lead free HASL2.5um
Immersion GoldNickel  3-7um  Au: 1-3u' '
OSP0.2-0.5um
Outline
Panel Outline Tol (+/-)± 0.004' ' (± 0.1mm)
Beveling30° 45°
V-cut15° 30° 45° 60°
Certificate ROHS  ISO9001: 2000  TS16949  SGS   UL

sample picture

 product authentication

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HDI PCB with BGA, Blind and Buried via, Made of FR4 Material



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